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Shenzhen Xinxing Electric Technology Co., Ltd.
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Cheap fpc/ffc flexible flat cable

Cheap fpc/ffc flexible flat cable

Supply Ability : 35000 Square Meter/Square Meters per Month
Port : shenzhen
Packaging Details : Vacuum package with carton
MOQ : 1 Piece/Pieces
Delivery Time : PCB5-8 workdays
Payment Terms : T/T,Western Union
FOB Price : Get Latest Price
Place of Origin : Guangdong
Brand Name : Xing Da
Model Number : FPCB
Base Material : FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crockery,Metal-backed
Green : Green
Surface Finishing : HASL / HASL lead free, Chemical tin, Chemical Gold,OSP
Board Thickness : 0.05-0.5mm
Min. Line Spacing : 0.04mm
Min. Line Width : 0.04mm
Copper Thickness : 1/2 oz min; 12 oz max
Min. Hole Size : 0.2mm
Category : FPC
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FPCA 1.adopt OEM &ODM
2.enjoy popularity in Asia & Europe
3.ISO14001:2004 & ISO9001:2000
4.high quality &best service
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(Xing Da Electric Technology Co.,Ltd),which has been specializing in PCB/PCBA and Electronic components for many years.

We can prvide a package of service:

pcba pcb assembly ts16949,PCB Assembly service,SMT PCBA,pcba pcb assembly ts16949,PCB Assembly SMT&SMD Processing service,China PCBA EMS Manufacturer,PCB Assembly DIP service,UPS PCB Assembly,pcb assembly for li ion battery charger,Telecommunication PCBA motherboard,China PCB Assembly soldering supplier/manufacturer, Steamer pcb controller/pcb holder/pcb assembly, OSP surface Juicer pcba/air conditioner pcb controller/pcb solder mask

  • 1. PCB layout, PCB design;
  • 2: Make high difficulty PCB(1 to 38 layers)
  • 3: Provide all Electronic components;
  • 4: PCB assembly;
  • 5: Write programs for clients;
  • 6: PCBA/finished product Test.
  • etc…

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1.Specification for FPC Manufacture:

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ItemSingle board-, ,multilayer board, flexible boardmultilayer board ,High density multilayer board ,rigid-flex printed circuit board(More than four layers flexible board)
Layer1-2 layer (flex board)2-8 layer )1-8 layer(flex board),2-16layer((rigid-flex)
Finish board size(Max)250×650mm250×650mm
Board Thickness0.0765mm-0.6mm0.0765mm-0.6mm
Min.Trace Width & Line Spacing0.05mm/0.05mm(1/3OZCopper foil)0.05mm/0.05mm(1/3OZCopper foil)
Board Thickness tolerance±0.05mm±0.05mm
Insulating layer Thickness12.5-50um12.5um or < 50um
PTH Hole Dia.Tolerance≥0.1mm≥0.1mm
Min.Hole Diameter for CNC Driling0.2mm0.2mm
Min.Hole Diameter for punching0.1mm0.1mm
Min half Round hole-apertureΦ=0.3MMΦ=0.3MM
Hole Tolerance(Crossing hole)±0.075mm±0.075mm
Drilling hole Tolerance(not Crossing)±0.05mm±0.05mm
Hole Positon±0.1mm±0.1mm
Outline Tolerance±0.05mm±0.05mm
Immersion-Gold
Gold Thickness:0.025um-0.125um-------Tin Thickness:1um-4umGold Thickness:0.025um-0.125um-------Tin Thickness:1um-4um
Electrical Nickel-goldGold Thickness:0.025um-0.125um Tin Thickness:1um-5umGold Thickness:0.025um-0.125um-------Tin Thickness:1um-5um
Immersion TinSn:0.025um-0.125umSn:0.025um-0.125um
Anti-Tarnish(OSP)0.1um-0.5um0.1um-0.5um
HASH1-40um1-40um
Lead tin1-40um1-40um
Immersion-Ag
≥1.5um≥1.5um
Thermosetting white oil overprint Tolerance±0.2mm±0.2mm
Min width green oil0.125mm0.125mm
Min width thermosetting white oil0.4mm0.4mm
impedance control±100%±100%
Heat shock test260±5°C/10S/3T/No stratification
/foaming
260±5°C/10S/3T/No stratification
/foaming
solderability test260±5°C/3-5S/semi-humid≤3%260±5°C/3-5S/semi-humid≤3%
Finished peeling strength≥0.8KG/CM≥0.8KG/CM
pollution test≤3ug/inch2≤3ug/inch2
Finished aging72H,70°C72H,70°C
Product standardFactory mark:GB;IPC-3012;IPC-6013Ⅱ IPC-6013Ⅲ;Army mark;otherFactory mark:GB;IPC-3012;IPC-6013Ⅱ IPC-6013Ⅲ;Army mark;other
safety certificationUI794:otherUI794:other
certification of environmental protectionROSH;SGS6 test report;REACH 38 term test reportROSH;SGS6 test report;REACH 38 term test report

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Technical

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1).Professional surface mounting and through hole soldering technology;

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2).Various sizes,like 1206,0805,0603 components SMT technology;

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3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;

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4).Nitrogen gas reflow soldering technology for SMT;

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5).High standard SMT&Solder Assembly line;

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6).High density interconnected board placement technology capacity.

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Quote requirement

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1).Many agile forms of cooperation(OEM ,ODM) are welcome!

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2).The detailed files(Gerber files,specification and BOM);

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3).Clear pictures of PCBA or samples for us;

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4).PCBA Test method.


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