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Shenzhen Xinxing Electric Technology Co., Ltd.
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Heat milk control PCB Assembly

Shenzhen Xinxing Electric Technology Co., Ltd.
Shenzhen Xinxing Electric Technology Co., Ltd.
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)
Tel: 86-0755-29731535

Heat milk control PCB Assembly

Supply Ability : 50000 Square Meter/Square Meters per Month
Port : shenzhen
Packaging Details : Vacuum package with carton
MOQ : 1 Piece/Pieces
Delivery Time : PCB5-8 workdays
Payment Terms : T/T,Western Union
FOB Price : Get Latest Price
PCB Assembly : PCB Assembly
Place of Origin : Guangdong
Brand Name : Xing Da
Model Number : PCB Assembly
Base Material : HASL / HASL lead free, Chemical tin, Chemical Gold,OSP
Surface Finishing : HASL / HASL lead free, Chemical tin, Chemical Gold,OSP
Board Thickness : 0.2mm-6mm(8mil-126mil)
Min. Line Spacing : 0.1mm
Min. Line Width : 0.075mm(3mil)
Copper Thickness : 1/2 oz min; 12 oz max
Min. Hole Size : 0.1mm(4mil)
Category : Multilayer PCB
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Heat Milk Control PCBA Assembly
1.Adopt OEM &ODM
2.No MOQ
3.ISO9001/TS16949/IPC/ROHS/UL

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Shenz Tea Set PCBA hen Xindaxing Electric Technology Co., Ltd.

(Xing Da Electric Technology Co.,Ltd),which has been specializing in PCB/PCBA- and Electronic components for many years

We can prvide a package of service:

-1.High quality--PCB board- Maker ,PCB manufacturer ,PCB factory, we can provide our clients with ravious kinds of-high quality-PCB and defferent kinds of service ,from pcb layout to assembly all parts

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Supply--Heat Milk Control PCBA- Assembly.

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2.Adopt OE M & ODM

3.Enjoy popularity in Asia & Europe
4.ISO14001:2004 PCBA Mobile DVD PCBA& ISO9001:2000
5.ROHs printed board
6.High quality printed circuit boards with the best price
7.The best service for printed wire board
8.Pcb manufacturer, pcb factory, pcb maker,
pcb supplier, pcb seller, pcb exporter
9.Be able to handle high difficult pcb and pcba

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Our advantaged products and service:

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PCB Layout,PCBA Factory,HDI PCB,Printed circuit board,

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BGA PCB,Printed circuit board,Heavy copper PCB,Heavy Au PCB,

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Heavy Gold PCB,Ceramic PCB,Pottery PCB.Crockery PCB.FPC,FPCA,

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Flexible PCB/Printed circuit boards,Flexible PCB assembly. Carbon Oil PCB,

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Carbon Printed circuit boards.High TG PCB,All Electronic Components,

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PCB Assembly,Write programs,PCBA test

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Detailed terms for PCB Assembly

Technical requirement

1)Professional surface-mounting and Through-hole soldering technology

2)Various sizes like 1206,0805,0603 components SMT technology

3)ICT (In Circuit Test),FCT (Functional Circuit Test ) technology

4)PCB Assembly with VL.CE.FCC.Rohs Approval

5)Nitrogen gas reflow soldering technology for SMT

6)High standard SMT&Solder Assembly Line

7)High density interconnected board place ment technology capacity

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Many agile forms of cooperation(OEM ,ODM) are welcome!

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Give us the detailed files(Gerber files and specification )or samples,

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We will be very happy to quote for you.

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Our first-class technology, best service and reasonable price will attract you!

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If you have any query,don't hesitate to contact us!We'd like to help you!

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Welcome to visit our factory!

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-1.Specification for PCB Manufacture:

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Item

Specification

Numbr of Layer

1-38Layers

Material

FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic-, crockery

Metal-backed Laminate

Remarks

High Tg CCL Is Availabe(Tg>=170ºC)

Finish Board Thickness

0.2mm-6.00 mm(8mil-126mil)

Minimun Core Thickness

0.075mm(3mil)

Copper Thickness

1/2 oz min;12 oz max

Min.Trace Width & Line Spacing

0.075mm/0.1mm(3mil/4mil)

Min.Hole Diameter for CNC Driling

0.1mm(4mil)

Min.Hole Diameter for punching

0.9mm(35mil)

Biggest panel size

610mm*508mm

Hole Positon

+/-0.075mm(3mil) CNC Driling

Conductor Width(W)

+/-0.05mm(2mil)or

+/-20% of original artwork

Hole Diameter(H)

PTH L:+/-0.075mm(3mil)

Non-PTH L:+/-0.05mm(2mil)

Outline Tolerance

+/-0.125mm(5mil) CNC Routing

+/-0.15mm(6mil) by Punching

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110×100mm(min)

660×600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min.spacing between hole edge to circuity pqttern of an inner layer

0.25mm(10mil)

Min.spacing between board oulineto circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

6 layers:+/-0.15mm(6mil)

Impedance Control

+/-10%

Different Impendance

+-/10%

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